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99.5% High Thermal Low Dielectric Beryllium Ceramic Substrate BeO ceramics

$10.99
MOQ:
In stock

Beryllium oxide is a kind of white amorphous powder which is not soluble in water. Due to its extremely high melting point and excellent thermal conductivity, it is generally used in microwave high-power electric vacuum devices and microelectronic packaging devices.

When your application requires a material that combines high thermal conductivity and electrical resistivity, consider the benefits of using BeO ceramics.

BeO is flexible in applications and superior in performance. We process beryllium oxide powder by pressing, sintering or extruding it into a variety of customized shapes or forms that deliver exceptional thermal properties. Beryllium oxide thermal ceramics are frequently used in high-performance semiconductor applications, microwave devices, heat sinks, electronics packaging, vacuum tubes, gas lasers and magnetrons.

BeO ceramic materials are ideal in thermal management applications when product design considerations include:

· Miniaturizing the physical size of the device or enclosure

· Exposing the component to high ambient temperatures

· Airflow or liquid cooling is not possible or is prohibitively expensive

· Applications that require a ceramic that insulates against electricity

· Melting and sintering operations at very high temperatures for crucibles

Basic of the specification:

Beryllium oxide property

Melting point:2575°C

Boiling point:4300 ° C

Density:2.88 g/mL at 25 °C (lit.)

Refractive index: 1.733

Flashpoint: 4300 ° C

Form: Powder

Specific gravity: 3.01

Color: white

Insoluble in water: Slowly soluble in concentrated acids, alkali hydroxides

Merck 14,1172

Stability: Stable.

BeO CERAMIC SUBSTRATE STANDARD SIZE

thickness(mm)

L*w (mm

L*W (mm)

L*W(mm)

L*W(mm)

0.385

2''*2''

50.8*50.8mm

3''*3''

76.2*76.2mm

4''*4''

100*100mm

 4.5''*4.5''

114.3*114.3mm

0.5

2''*2''

50.8*50.8mm

3''*3''

76.2*76.2mm

4''*4''

100*100mm

 4.5''*4.5''

114.3*114.3mm

0.635

2''*2''

50.8*50.8mm

3''*3''

76.2*76.2mm

4''*4''

100*100mm

 4.5''*4.5''

114.3*114.3mm

1.0

2''*2''

50.8*50.8mm

3''*3''

76.2*76.2mm

4''*4''

100*100mm

 4.5''*4.5''

114.3*114.3mm

1.5

2''*2''

50.8*50.8mm

3''*3''

76.2*76.2mm

4''*4''

100*100mm

 4.5''*4.5''

114.3*114.3mm

 

High thermal conductivity and low dielectric constant are the real reasons that BeO materials were widely used in electronic technologies, BeO ceramic is currently used in high-performance, high-power microwave packages, BeO substrates have also been used for high circuit density multi-chip components, Use BeO material to dissipate the heat generated in the system in time to ensure the system stability and reliability. Metalized thick film lithographic substrates on BeO substrates are well suited for high-reliability high-density microwave circuits. These substrates can be Working under conditions above 44 GHz for Tel-communications, live broadcasts, Satellite communication modules, mobile phones, personal communication services, base stations, advanced avionics, and Global Positioning System (GPS). Size can be and space scales as small as 0.001 inches, and routinely mounted in 4 x 4 Inches on the substrate. SiC-reinforced aluminum metal matrix composites combined with DBC- BeO substrate has been successfully used for high current IGBT (insulated gate bipolar transistor). The design of the module substrate. Al/ SiC material combines high heat Dissipative, low aluminum alloy density, and low coefficient of thermal expansion, and BeO The substrate is matched so that the thermal stress at the joint is reduced.

Why choose Coraynic Technology

--Sufficient supply

--Completive price

--Excellent performance 

--Good service 

--Top-quality raw material 

--Prompt delivery

Stock and transportation conditions:

Before transporting, check whether the packaging container is complete and sealed. During transportation, ensure that the container does not leak, collapse, fall or damage. It is strictly forbidden to mix with acids, oxidants, foods and food additives. Transport vehicles should be equipped with leakage emergency handling equipment when transporting. During transportation, it should be protected from exposure, rain and high temperature. When transporting by road, follow the prescribed route and do not stay in residential areas and densely populated areas.

Health hazard

Ingestion or vacuuming can be poisoned. Acute poisoning can cause bronchitis, peribronchial inflammation, and bronchial pneumonia. It can cause dermatitis, skin ulcers and skin granuloma. Chronic exposure can cause diffuse granulomatous lesions in the lungs.

 

first-aid

Skin contact: Remove contaminated clothing and rinse with plenty of running water. Eye contact: Lift eyelids and rinse with running water or saline. Seek medical attention. Inhalation: Remove quickly from the scene to fresh air. Keep the airway open. If breathing is difficult, give oxygen. If breathing stops, take artificial respiration immediately and seek medical attention. Ingestion: Drink plenty of warm water and induce vomiting. Seek medical attention.

Our team can assist with selecting an optimal product for your RF and microwave microelectronics packaging. Contact our engineers for the best solution!

 

 


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